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Type C2Q

Surface Mount Very Fast-Acting Chip Fuse

0603 size

C2QD1005

EC2QD1005A1

Consult manufacturer for other ratings

Physical Specification

Materials

Ceramic Substrate / Printed Element

Marking

On fuse:

None

Label on reel :

“bel”,“C2Q”, “Current Rating”, “Voltage Rating”,“ Interrupting Rating”,

“Appropriate Safety Logos” and “

” for RoHS Version

Packaging

5,000 fuses in 7 inches dia. reel, 8 mm wide tape, 4 mm pitch per EIA-481

(equivalent IEC-286 part 3)

Mechanical Dimensions

C2Q

19

1.60mm +0.13

mm

(0.063" +0.005

")

0.76mm

(0.03 ")

Protective Overglaze

Element

Ti n Plating

Nickel Barrier

Sliver Metalization

Ceramic Substrate

0.30mm +0.10mm

(0.012

" +0.004")

-

0.48mm+

0.08mm

(0.019"+0

.003")

-

0.76mm

(0.03 ")

1.27mm

(0.05 ")

0.66mm

(0.026 ")

PAD LAYOUT RECOMMENDED

FOR WAVE SOLDER

PAD LAYOUT RECOMMENDED

FOR INFRARED SOLDER

1.02mm

(0.04")

0.76mm

(0.03 ")

0.79mm +0.10mm

(0.031

" + 0.004")

-

_

_

-

-

-

RoHS Compliant

RoHS Compliant Product

RoHS Reflow Reference : JEDEC J-STD-020C (260

°C,40 sec max)

RoHSWave Soldering Compatible : (260

°C,10 sec max)

Environmental Specification

Shock Resistance

MIL-STD-202G, Method 213B,Test Condition I

(100 G’s peak for 6 milliseconds; Sawtooth Waveform)

Vibration Resistance

MIL-STD-202G, Method 201A (10-55 Hz, 0.06 inch, total excursion)

Salt Spray Resistance

MIL-STD-202G, Method 101E,Test condition B (48 hrs)

Insulation Resistance

MIL-STD-202G, Method 302,Test Condition A

(After Opening) 10,000 ohms minimum

Solderability

MIL-STD-202G, Method 208H

Soldering Heat Resistance

MIL-STD-202G Method 210F, Test Condition C.Top Side

(260

°C, 20 sec)

MIL-STD-202G Method 210F, Test Condition D. Bottom Side

(260

°C,10sec)

Thermal Shock Resistance

MIL-STD-202G, Method 107G,Test Condition B

(-65

°C to +125°C)

Operating Temperature

-55

°C to +125°C

Approvals

Electrical Characteristics

(UL STD. 248-14)

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