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STW29NK50Z Datasheet(PDF) 3 Page - STMicroelectronics |
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STW29NK50Z Datasheet(HTML) 3 Page - STMicroelectronics |
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3 / 10 page ![]() 3/10 STW29NK50Z TABLE 7: ELECTRICAL CHARACTERISTICS (TCASE =25°C UNLESS OTHERWISE SPECIFIED) On /Off Table 8: Dynamic Table 9: Source Drain Diode (1) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %. (2) Pulse width limited by safe operating area. Symbol Parameter Test Conditions Min. Typ. Max. Unit V(BR)DSS Drain-source Breakdown Voltage ID = 1 mA, VGS = 0 500 S IDSS Zero Gate Voltage Drain Current (VGS = 0) VDS = Max Rating VDS = Max Rating, TC = 125°C 1 50 µA µA IGSS Gate-body Leakage Current (VDS = 0) VGS = ± 20 V ± 10 µA VGS(th) Gate Threshold Voltage VDS = VGS, ID = 150 µA 3 3.75 4.5 V RDS(on) Static Drain-source On Resistance VGS = 10 V, ID = 15.5 A 0.105 0.13 Ω Symbol Parameter Test Conditions Min. Typ. Max. Unit gfs (1) Forward Transconductance VDS = 15 V, ID = 15.5 A 24 S Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 25 V, f = 1 MHz, VGS = 0 6110 697 166 pF pF pF td(on) tr td(off) tf Turn-on Delay Time Rise Time Turn-off-Delay Time Fall Time VDD = 250 V, ID = 15 A, RG = 4.7 Ω, VGS = 10 V (Resistive Load see Figure 17) 44.5 41 129 33 ns ns ns ns Qg Qgs Qgd Total Gate Charge Gate-Source Charge Gate-Drain Charge VDD = 400 V, ID = 30 A, VGS = 10 V 190 35.5 111 266 nC nC nC Symbol Parameter Test Conditions Min. Typ. Max. Unit ISD ISDM (2) Source-drain Current Source-drain Current (pulsed) 31 124 A A VSD (1) Forward On Voltage ISD = 31 A, VGS = 0 1.6 V trr Qrr IRRM Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD = 30 A, di/dt = 100 A/µs VDD = 44.8V, Tj = 25°C (see test circuit Figure 5) 436 6.1 28 ns µC A trr Qrr IRRM Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD = 30 A, di/dt = 100 A/µs VDD = 44.8V, Tj = 150°C (see test circuit Figure 5) 500 7.5 30 ns µC A |
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