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VT16374ADGG Datasheet(PDF) 4 Page - NXP Semiconductors

Part # VT16374ADGG
Description  3.3V LVT 16-bit edge-triggered D-type flip-flop 3-State
PDF  10 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

VT16374ADGG Datasheet(HTML) 4 Page - NXP Semiconductors

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Philips Semiconductors
Product specification
74LVT16374A
3.3V 16-bit edge-triggered D-type flip-flop
(3-State)
1999 Oct 18
4
FUNCTION TABLE
INPUTS
INTERNAL
OUTPUTS
OPERATING MODE
nOE
nCP
nDx
REGISTER
nQ0 - nQ7
OPERATING MODE
L
L
↑
↑
l
h
L
H
L
H
Load and read register
L
↑
X
NC
NC
Hold
H
H
↑
↑
X
nDx
NC
nDx
Z
Z
Disable outputs
H = High voltage level
h
= High voltage level one set-up time prior to the High-to-Low E transition
L
= Low voltage level
l
= Low voltage level one set-up time prior to the High-to-Low E transition
NC= No change
X = Don’t care
Z = High impedance “off” state
↑ = Low-to-High clock transition
↑ = Not a Low-to-High clock transition
LOGIC DIAGRAM
CP Q
D
nD0
nQ0
CP Q
D
nD1
CP Q
D
nD2
CP Q
D
nD3
CP Q
D
nD4
CP Q
D
nD5
CP Q
D
nD6
CP Q
D
nD7
nQ1
nQ2
nQ3
nQ4
nQ5
nQ6
nQ7
nCP
nOE
SW00019
ABSOLUTE MAXIMUM RATINGS1, 2
SYMBOL
PARAMETER
CONDITIONS
RATING
UNIT
VCC
DC supply voltage
-0.5 to +4.6
V
IIK
DC input diode current
VI < 0
-50
mA
VI
DC input voltage3
-0.5 to +7.0
V
IOK
DC output diode current
VO < 0
-50
mA
VOUT
DC output voltage3
Output in Off or High state
-0.5 to +7.0
V
IOUT
DC output current
Output in Low state
128
mA
IOUT
DC out ut current
Output in High state
-64
mA
Tstg
Storage temperature range
-65 to +150
°C
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150
°C.
3. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.



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