DocID028873 Rev 1

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ST32GxxxA

Description

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1.1

Package features

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

1.1.1

DFN8 package qualification for M2M automotive applications

Package qualification for M2M automotive applications, according to AEC Q100 standard:



Moisture Sensitivity Level test according to IPC/JEDEC J-STD-20: MSL1 with 260 °C

peak temperature.



Temperature Humidity Bias test according to JEDEC JESD22-A101: 85 °C, 85% RH,

1000 hours.



Autoclave test according to JEDEC JESD22-A102: 121°C, 100% RH, 205 kPa,

96 hours.



Vibration test according to JEDEC JESD22-B103 service condition 1: 20 / 2000 Hz,

20 g peak acceleration.



Mechanical Shock test according to JEDEC JESD22-B104 service condition B: 1500 g

acceleration for 0.5 ms pulse duration.



Temperature cycling test according to JEDEC JESD22-A104: –65 / +150 °C,

500 cycles.

1.1.2

Package information

For a complete description of available packages and micromodules, refer to the

ST32GxxxA package mechanical data - package information.

1.2

Software development tool description

Dedicated Cortex™-M3 software development tools are provided by ARM and Keil®. This

includes the Instruction Set Simulator (ISS) and C compiler. The documentation is available

on the ARM and Keil websites.

Moreover, STMicroelectronics provides:



A time-accurate hardware emulator controlled by the Keil debugger and the ST

development environment.



A complete product simulator based on Keil’s ISS simulator for the Cortex™-M3 CPU.



A ROMed Flash memory loader with very high-speed software downloading

capabilities.