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ACTS08MS Datasheet(PDF) 6 Page - Renesas Technology Corp |
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ACTS08MS Datasheet(HTML) 6 Page - Renesas Technology Corp |
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6 / 8 page ![]() ACTS08MS FN3994 Rev 0.00 Page 6 of 8 April 1995 Metallization Mask Layout ACTS08MS (6) (9) Y2 A3 A1 VCC B4 (1) (14) (13) (10) B3 (12) A4 Y1 (3) A2 (4) B2 (5) B1 (2) NC (8) Y3 (11) Y4 NC GND (7) Die Characteristics DIE DIMENSIONS: 88 mils x 88 mils 2.24mm x 2.24mm METALLIZATION: Type: AlSiCu Metal 1 Thickness: 6.75k Å (Min), 8.25kÅ (Max) Metal 2 Thickness: 9k Å (Min), 11kÅ (Max) GLASSIVATION: Type: SiO2 Thickness: 8k Å 1kÅ DIE ATTACH: Material: Silver Glass or JM 7000 Polymer after 7/1/95 WORST CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: > 4.3 mils x 4.3 mils > 110 m x 110m |
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