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HCS02MS Datasheet(PDF) 8 Page - Renesas Technology Corp |
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HCS02MS Datasheet(HTML) 8 Page - Renesas Technology Corp |
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8 / 8 page  HCS02MS FN2433 Rev 2.00 Page 8 of 8 August 1995 Die Characteristics DIE DIMENSIONS: 87 x 88 mils 2.20mm x 2.24mm METALLIZATION: Type: AlSi Metal Thickness: 11k Å 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 m x 100m 4 x 4 mils Metallization Mask Layout HCS02MS Y1 VCC Y4 A1 (2) B1 (3) Y2 (4) A2 (5) (12) B4 (11) A4 (10) Y3 (9) B3 (6) (7) (8) (1) (14) (13) B2 GND A3 |
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