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AC01 Datasheet(PDF) 19 Page - NXP Semiconductors |
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AC01 Datasheet(HTML) 19 Page - NXP Semiconductors |
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19 / 24 page ![]() 2000 Oct 20 19 BCcomponents Product specification Cemented wirewound resistors AC01/03/04/05/07/10/15/20 Fig.29 Lead length as a function of the dissipation with the temperature rise at the end of the lead (soldering spot) as a parameter. 0 25 20 15 10 12 4 MGB732 3 P (W) lead length (mm) 50 K ∆T = 40 K 60 K 70 K 80 K AC04 Fig.30 Lead length as a function of the dissipation with the temperature rise at the end of the lead (soldering spot) as a parameter. 0 25 20 15 10 15 MGB733 23 4 P (W) lead length (mm) 50 K ∆T = 40 K 60 K 70 K 80 K 90 K 100 K AC05 Fig.31 Lead length as a function of the dissipation with the temperature rise at the end of the lead (soldering spot) as a parameter. 0 25 20 15 10 24 8 MGB734 6 P (W) lead length (mm) ∆T = 40 K 80 K 90 K 50 K 60 K 70 K AC07 Fig.32 Lead length as a function of the dissipation with the temperature rise at the end of the lead (soldering spot) as a parameter. AC10 20 25 10 05 10 MGB735 20 15 15 P (W) lead length (mm) 50 K 60 K 70 K 80 K ∆T = 40 K |
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