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HCS04MS Datasheet(PDF) 8 Page - Renesas Technology Corp |
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HCS04MS Datasheet(HTML) 8 Page - Renesas Technology Corp |
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8 / 8 page ![]() HCS04MS FN3046 Rev 1.00 Page 8 of 8 August 1995 Die Characteristics DIE DIMENSIONS: 87 x 88 mils 2.20mm x 2.24mm METALLIZATION: Type: AlSi Metal Thickness: 11k Å 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 m x 100m 4 x 4 mils Metallization Mask Layout HCS04MS Y1 (2) A2 (3) Y2 (4) A3 (5) (12) Y6 (11) A5 (10) Y5 (9) A4 |
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