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HCS08K Datasheet(PDF) 8 Page - Renesas Technology Corp |
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HCS08K Datasheet(HTML) 8 Page - Renesas Technology Corp |
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8 / 8 page  HCS08MS FN3047 Rev 1.00 Page 8 of 8 August 1995 Die Characteristics DIE DIMENSIONS: 87 x 88 mils 2.20 x 2.24mm METALLIZATION: Type: AlSi Metal Thickness: 11k Å 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 m x 100m 4 mils x 4 mils Metallization Mask Layout HCS08MS VCC B4 B1 (2) Y1 (3) A2 (4) B2 (5) (12) A4 (11) Y4 (10) B3 (9) A3 (6) (7) (8) Y2 GND Y3 A1 (1) (14) (13) |
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