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HCS573MS Datasheet(PDF) 10 Page - Renesas Technology Corp |
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HCS573MS Datasheet(HTML) 10 Page - Renesas Technology Corp |
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10 / 10 page ![]() HCS573MS FN4056 Rev 0.00 Page 10 of 10 September 1995 Die Characteristics DIE DIMENSIONS: 101 x 85 mils METALLIZATION: Type: SiAl Metal Thickness: 11k Å 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 m x 100m 4 x 4 mils Metallization Mask Layout HCS573MS OE (1) D0 (2) VCC (20) Q0 (19) D1 (3) D3 (5) D4 (6) D5 (7) (9) (10) D7 GND (11) LE (12) Q7 D2 (4) D6 (8) (18) Q1 (17) Q2 (16) Q3 (15) Q4 (14) Q5 (13) Q6 |
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