8.2.3 Application Curves

at operating temperature TJ = 25°C, VIN = VOUT(NOM) + 1.0 V or 2.5 V (whichever is greater), IOUT = 1 mA, CIN = 1 µF, and

COUT = 1 µF (unless otherwise noted)

Time (50 ms/div)

5.3

4.3

100

50

0

50

-

V

= 3.0 V

I

= 50 mA

C

= 10 F

IN

OUT

OUT

m

Figure 8-3. Line Transient Response for Legacy Chip

t - Time -

s

0

50

100 150 200 250 300 350 400 450 500

4

-300

4.5

-250

5

-200

5.5

-150

6

-100

6.5

-50

7

0

7.5

50

8

100

8.5

150

VOUT = 3.3V

IOUT = 50mA

COUT = 10F

dV/dt = 0.2V/

s

VIN

VOUT

Figure 8-4. Line Transient Response for New Chip

Time (0.5 ms/div)

100

50

0

200

0

200

-

V

= 4.0 V

V

= 3.0 V

C

= 10 F

IN

OUT

OUT

m

Figure 8-5. Load Transient Response for Legacy Chip

Time (

s)

0

500

1000

1500

2000

2500

3000

3500

0

-1000

50

-800

100

-600

150

-400

200

-200

250

0

300

200

350

400

400

600

IOUT

VOUT

Figure 8-6. Load Transient Response for New Chip

t - Time - ms

0

2

4

6

8

10

12

14

16

18

20

22

0

1

2

3

4

5

6

7

8

VOUT

VIN

VOUT = 3.3V

IOUT = 50mA

COUT = 10F

Figure 8-7. Power-Up, Power-Down for New Chip

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TLV701

SBVS161A – NOVEMBER 2011 – REVISED APRIL 2023

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