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© Koninklijke Philips Electronics N.V. 2004. All rights reserved.

Product data sheet

Rev. 02 — 26 July 2004

3 of 9

Philips Semiconductors

PRS07 series

Fast soft-recovery rectifiers

5.

Thermal characteristics

Device mounted as shown in Figure 6.

Fig 1.

Average forward current as a function of

tie-point temperature (including losses due to

reverse leakage); maximum values.

Fig 2.

Average forward current as a function of

ambient temperature (including losses due to

reverse leakage); maximum values.

003aaa637

0

1

2

3

0

40

80

120

160

(A)

003aaa638

0

0.2

0.4

0.6

0.8

0

40

80

120

160

(A)

Table 4:

Thermal characteristics

Symbol Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from junction to tie-point

-

30

-

K/W

thermal resistance from junction to ambient

mounted on a printed-circuit

board, 1.5 mm thick; copper

thickness

≥ 40 µm; Figure 6

-

150

-

K/W