© 2006 CTS Corporation. All rights reserved. Information subject to change.

CTS Electronic Components

Page 2

March 06

www.ctscorp.com

LVPECL Terminators

Complete ClearONE Product, Processing, and Application Information can be found at the following link:

http://www.ctscorp.com/components/clearone.asp

Solder Mask Dia = Pad

Diameter +.15mm (.006 inch)

BGA Routing Scheme

Blind vias to V

EE

reference plane layer

recommended on

every other row as

shown.

Signal Lines -

9 mil trace width

or similar to

achieve

controlled 50

Ohm

transmission line

impedance Zo.

Blind vias to V

CC

reference plane layer

recommended on

every other row as

shown.

Mechanical Diagram

K

P (Pitch)

L

W

H

P (Pitch)

A1 Identifier

RT_250B_

CTS YRWK

D

1.00mm Pitch

L

W

H

P

D

K

mm

8.00

±0.15

3.00

±0.15

1.19

±0.15

1.00

±0.25

0.64

±0.05

0.50

±0.25

RT1250B7

RT2250B7

inch

.315

±.006

.118

±.006

.047

±.006

.039

±.010

.025

±.002

.020

±.010

1.27mm Pitch

L

W

H

P

D

K

mm

10.16

±0.15

3.81

±0.15

1.32

±0.15

1.27

±0.25

0.76

±0.05

0.64

±0.25

RT1250B6

RT2250B6

inch

.400

±.006

.150

±.006

.052

±.006

.050

±.010

.030

±.002

.025

±.010

Recommended Land Pattern

1.00mm Pitch (B7) = 0.51mm/.020 inch (minimum)

1.27mm pitch (B6) = 0.64mm/.025 inch (minimum)

Outline of Substrate

PCB Pad Diameter

For .006" Thick Solder Paste Stencil, Aperture Opening Should

be Equal to the PCB Pad Diameter.

additional PCB design information