6 Pin Configuration and Functions

1

A2

12

FDA_IN+

2

IN+

11

OUT–

3

IN–

10

OUT+

4

A0

9

FDA_IN–

Not to scale

Thermal Pad

Figure 6-1. RGT Package, 16-Pin VQFN (Top View)

Table 6-1. Pin Functions

PIN

TYPE

DESCRIPTION

NAME

NO.

A0

4

Input

Gain option pin 0

A1

5

Input

Gain option pin 1

A2

1

Input

Gain option pin 2

DGND

16

Power

Ground reference for digital logic and gain setting pins

FDA_IN–

9

Input

Connection to output driver summing node

FDA_IN+

12

Input

Connection to output driver summing node

IN–

3

Input

Negative (inverting) input

IN+

2

Input

Positive (noninverting) input

LVDD

7

Power

Output driver positive supply

LVSS

14

Power

Output driver negative supply

NC

8

—

Do not connect

OUT–

11

Output

Output (inverting)

OUT+

10

Output

Output (noninverting)

VOCM

13

Input

Level set for output common mode value

VS+

6

Power

Input stage positive supply

VS–

15

Power

Input stage negative supply

Thermal Pad

Thermal pad

—

The thermal pad must be soldered to the printed-circuit board (PCB). Connect thermal pad

to a plane or large copper pour that is either floating or electrically connected to VS–, even

for applications that have low power dissipation.

PGA855

SBOSAE0 – APRIL 2023

www.ti.com

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