Nexperia

NHDTC114/124/144EU series

80 V, 100 mA NPN resistor-equipped transistors

9. Thermal characteristics

Table 7. Thermal characteristics

Tamb = 25 °C unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

[1]

-

-

532

K/W

Rth(j-a)

thermal resistance from junction to ambient

in free air

[2]

-

-

397

K/W

Rth(j-sp)

thermal resistance from junction to solder point

-

-

150

K/W

[1] Device mounted on an FR4 Printed-Circuit-Board (PCB); single-sided copper; tin-plated and standard footprint.

[2] Device mounted on an FR4 Printed-Circuit Board (PCB), 4-layer copper, tin-plated and standard footprint.

aaa-031870

10-5

10

10-2

10-4

102

10-1

tp (s)

10-3

103

1

102

10

103

Zth(j-a)

(K/W)

1

duty cycle = 1

0.75

0.50

0.33

0.20

0.01

0.10

0.05

0

0.02

FR4 PCB, single-sided copper, tin-plated and standard footprint

Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

aaa-031871

10-5

10

10-2

10-4

102

10-1

tp (s)

10-3

103

1

102

10

103

Zth(j-a)

(K/W)

1

duty cycle = 1

0.75

0.50

0.33

0.20

0.01

0.10

0.05

0.02

0

FR4 PCB, 4-layer copper, tin-plated and standard footprint

Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

NHDTC114_124_144EU_SER

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Nexperia B.V. 2020. All rights reserved

Product data sheet

Rev. 1 — 16 July 2020

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