BSP75N

Document number: DS33016 Rev. 6 - 2

3 of 9

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June 2022

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BSP75N

Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Parameter

Symbol

Limit

Unit

Continuous Drain-Source Voltage

VDS

60

V

Drain-Source Voltage for Short Circuit Protection VIN = 5V

VDS(SC)

36

V

Drain-Source Voltage for Short Circuit Protection VIN = 10V

VDS(SC)

20

V

Continuous Input Voltage

VIN

-0.2 to 10

V

Peak Input Voltage

VIN

-0.2 to 20

V

Operating Temperature Range

TJ

-40 to +150

°C

Storage Temperature Range

TSTG

-55 to +150

°C

Power Dissipation at TA = +25°C (Note 5)

PD

1.5

W

Power Dissipation at TA = +25°C (Note 6)

PD

0.6

W

Continuous Drain Current @ VIN = 10V; TA = +25°C (Note 5)

ID

1.3

A

Continuous Drain Current @ VIN = 5V; TA = +25°C (Note 5)

ID

1.1

A

Continuous Drain Current @ VIN = 5V; TA = +25°C (Note 6)

ID

0.7

A

Continuous Source Current (Body Diode) (Note 5)

IS

2.0

A

Pulsed Source Current (Body Diode) (Note 7)

IS

3.3

A

Unclamped Single Pulse Inductive Energy

EAS

550

mJ

Load Dump Protection

VLOAD_DUMP

80

V

Electrostatic Discharge (Human Body Model)

VESD

4000

V

DIN Humidity Category, DIN 40 040

—

E

—

IEC Climatic Category, DIN IEC 68-1

—

40/150/56

—

Thermal Resistance

Parameter

Symbol

Limit

Unit

Junction to Ambient (Note 5)

RθJA

83

C/W

Junction to Ambient (Note 7)

RθJA

45

C/W

Junction to Ambient (Note 6)

RθJA

208

C/W

Notes:

5. For a device surface mounted on 25mm x 25mm x 1.6mm FR-4 board with a high coverage of single-sided 2oz weight copper. Allocation of 6cm2 copper

33% to source tab and 66% to drain pin with source tab and drain pin electrically isolated.

6. For a device surface mounted on FR-4 board with the minimum copper required for electrical connections.

7. For a device surface mounted on FR-4 board as (a) and measured at t < = 10s.