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BC369 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BC369 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 8 page ![]() 1999 Apr 26 3 Philips Semiconductors Product specification PNP medium power transistor BC369 THERMAL CHARACTERISTICS Note 1. Transistor mounted on an FR4 printed-circuit board. CHARACTERISTICS Tj =25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient note 1 150 K/W SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT ICBO collector cut-off current IE = 0; VCB = −25 V −−100 nA IE = 0; VCB = −25 V; Tj = 150 °C −−10 µA IEBO emitter cut-off current IC = 0; VEB = −5V −−100 nA hFE DC current gain IC = −5 mA; VCE = −10 V 50 − IC = −500 mA; VCE = −1 V; see Fig.2 85 375 IC = −1 A; VCE = −1 V; see Fig.2 60 − DC current gain IC = −500 mA; VCE = −1 V; see Fig.2 BC369-16 100 250 BC369-25 160 375 VCEsat collector-emitter saturation voltage IC = −1 A; IB = −100 mA −−0.5 V VBE base-emitter voltage IC = −5 mA; VCE = −10 V −−0.7 V IC = −1 A; VCE = −1V −−1V fT transition frequency IC = −10 mA; VCE = −5 V; f = 100 MHz 40 − MHz DC current gain ratio of the complementary pairs I C = 500 mA; VCE =1V − 1.6 h FE1 h FE2 ----------- |
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