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BC846S Datasheet(PDF) 3 Page - NXP Semiconductors |
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BC846S Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 8 page ![]() 1999 Sep 01 3 Philips Semiconductors Product specification NPN general purpose double transistor BC846S THERMAL CHARACTERISTICS Note 1. Refer to SC-88 (SOT363) standard mounting conditions. CHARACTERISTICS Tamb =25 °C unless otherwise specified. Note 1. Pulse test: tp ≤ 300 µs; δ≤ 0.02. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient note 1 416 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Per transistor ICBO collector cut-off current IE = 0; VCB =30V −− 15 nA IE = 0; VCB =30V; Tj = 150 °C −− 5 µA IEBO emitter cut-off current IC = 0; VEB =5V −− 100 nA hFE DC current gain IC = 2 mA; VCE = 5 V 110 −− VCEsat collector-emitter saturation voltage IC = 10 mA; IB = 0.5 mA −− 100 mV IC = 100 mA; IB = 5 mA; note 1 −− 300 mV VBEsat base-emitter saturation voltage IC = 10 mA; IB = 0.5 mA − 770 − mV Cc collector capacitance IE =ie = 0; VCB =10V; f=1MHz −− 1.5 pF fT transition frequency IC = 10 mA; VCE =5V; f = 100 MHz 100 −− MHz |
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