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BC875 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BC875 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 8 page ![]() 1999 May 28 3 Philips Semiconductors Product specification NPN Darlington transistors BC875; BC879 THERMAL CHARACTERISTICS Note 1. Transistor mounted on an FR4 printed-circuit board. CHARACTERISTICS Tj =25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient note 1 150 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT ICES collector cut-off current BC875 VBE = 0; VCE =45V −− 50 nA BC879 VBE = 0; VCE =80V −− 50 nA IEBO emitter cut-off current IC = 0; VEB =4V −− 50 nA hFE DC current gain IC = 150 mA; VCE = 10 V; see Fig.2 1000 −− IC = 0.5 A; VCE = 10 V; see Fig.2 2000 −− VCEsat collector-emitter saturation voltage IC = 0.5 A; IB = 0.5 mA −− 1.3 V IC = 1 A; IB =1mA −− 1.8 V VBEsat base-emitter saturation voltage IC = 1 A; IB =1mA −− 2.2 V fT transition frequency IC = 0.5 A; VCE = 5 V; f = 100 MHz − 200 − MHz Switching times (between 10% and 90% levels) ton turn-on time ICon = 500 mA; IBon = 0.5 mA; IBoff = −0.5 mA − 500 − ns toff turn-off time − 1300 − ns |
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