Electronic Components Datasheet Search
  English  ▼

X  

LM3207TL Datasheet(PDF) 18 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # LM3207TL
Description  650mA Miniature, Adjustable, Step-Down DC-DC Converter for RF Power Amplifiers with Integrated Vref LDO
PDF  19 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM3207TL Datasheet(HTML) 18 Page - National Semiconductor (TI)

Back Button LM3207TL Datasheet HTML 11Page - National Semiconductor (TI) LM3207TL Datasheet HTML 12Page - National Semiconductor (TI) LM3207TL Datasheet HTML 13Page - National Semiconductor (TI) LM3207TL Datasheet HTML 14Page - National Semiconductor (TI) LM3207TL Datasheet HTML 15Page - National Semiconductor (TI) LM3207TL Datasheet HTML 16Page - National Semiconductor (TI) LM3207TL Datasheet HTML 17Page - National Semiconductor (TI) LM3207TL Datasheet HTML 18Page - National Semiconductor (TI) LM3207TL Datasheet HTML 19Page - National Semiconductor (TI)  
Zoom Inzoom in Zoom Outzoom out
 18 / 19 page
background image
Application Information (Continued)
BOARD LAYOUT FLOW
1.
Minimize C1, PV
IN,
and PGND loop. These traces
should be as wide and short as possible. This is most
important.
2.
Minimize L1, C2, SW and PGND loop. These traces also
should be wide and short. This is the second priority.
3.
Above layout patterns should be placed on the compo-
nent side of the PCB to minimize parasitic inductance
and resistance due to via-holes. It may be a good idea
that the SW to L1 path is routed between C2(+) and
C2(-) land patterns. If vias are used in these large cur-
rent paths, multiple via-holes should be used if possible.
4.
Connect C1(-), C2(-) and PGND with wide GND pattern.
This pattern should be short, so C1(-), C2(-), and PGND
should be as close as possible. Then connect to a PCB
common GND pattern with as many via-holes as pos-
sible.
5.
SGND should not connect directly to PGND. Connecting
these pins under the device should be avoided. (If pos-
sible, connect SGND to the common port of C1(-), C2(-)
and PGND.)
6.
FB line should be protected from noise. It is a good idea
to use an inner GND layer (if available) as a shield.
7.
The LDO Cap C7 (C
LDO) should be placed as close to
the PA as possible and as far away from the switcher to
suppress high frequency switch noises.
Note: The evaluation board shown in Figure 5 for the LM3207 was designed
with these considerations, and it shows good performance. However
some aspects have not been optimized because of limitations due to
evaluation-specific requirements. Please refer questions to a National
representative.
20165357
FIGURE 5. Evaluation Board Layout
www.national.com
18



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com