04-4

Note: All specifications are subject to change without notice.

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0

4

COM-CFHB6

Unit: mm

Block Diagram

Dimension

Unit: mm

Ordering Information

PART NUMBER

COM EXPRESS

TYPE

CPU

MEMORY

DISPLAY

LVDS

STORAGE

LAN

USB

UART

EXPANSION

POWER

TEMPERA-

TURE

OTHER

COM-CFHB6-A11-0001

Type 6

(COM.0 Rev. 3.0)

Xeon E-2176M

DDR4 SODIMM x 3

VGA,

DDI x 2 (up to 3)

18/24b 2ch LVDS/eDP SATA3 x 4

GbE x 1

USB 3.2 Gen 2 x 4

USB 2.0 x 8

2-wire (Tx/Rx) x 2

PCIe [x1] x 8

PCIe[x16] x 1

+12V

0°C ~ 60°C

LPC, SMBus, I2C

COM-CFHB6-A11-0002

Type 6

(COM.0 Rev. 3.0)

I7-8850H

DDR4 SODIMM x 3

VGA,

DDI x 2 (up to 3)

18/24b 2ch LVDS/eDP SATA3 x 4

GbE x 1

USB 3.2 Gen 2 x 4

USB 2.0 x 8

2-wire (Tx/Rx) x 2

PCIe [x1] x 8

PCIe[x16] x 1

+12V

0°C ~ 60°C

LPC, SMBus, I2C

COM-CFHB6-A11-0005

Type 6

(COM.0 Rev. 3.0)

Xeon E-2276ME

DDR4 SODIMM x 3

VGA,

DDI x 2 (up to 3)

18/24b 2ch LVDS/eDP SATA3 x 4

GbE x 1

USB 3.2 Gen 2 x 4

USB 2.0 x 8

2-wire (Tx/Rx) x 2

PCIe [x1] x 8

PCIe[x16] x 1

+12V

0°C ~ 60°C

LPC, SMBus, I2C

DDR4 SODIMM

Intel® 8th /9th Gen

Core/XEON

DMI 3.0

LPC

COM

Express

Type 6

ROW

C/D

ITE

EC IT8528

HW

Monitor

BIOS

eDP

NXP

eDP to LVDS

PTN3460

Channel A

Intel

GbE PHY

i219

COM

Express

Type 6

ROW

A/B

PCIE [x16] x1

DDI 1

USB 3.2 Gen 2 x 4

PCIe[x1] x 2

SPI

Chrontel

DP to VGA

CH7517

VGA

DDI 3

PCIe [x1] x6

SATA3 x 4

USB 2.0 x 8

LVDS

PCIe[x1] x1

Giga LAN

TPM

WDT/GPIO/FAN / TX RX*2

HD Audio

I2C x 1

Intel®

QM370 / CM246

Chipset

*TPM 2.0 is an option

COM-CFHB6

DDR4 SODIMM x 1

DDR4 SODIMM x 2

Channel B

DDI 2

eDP (Op�onal)

SMBUS x 1

TPM 2.0

Op�onal

DDI 3