6.4 Thermal Information

THERMAL METRIC (1)

Legacy chip

New chip

UNIT

DBV (SOT23-5)

DBV (SOT23-5)

5 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

205.4

178.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

78.8

77.9

°C/W

RθJB

Junction-to-board thermal resistance

46.7

47.2

°C/W

ψJT

Junction-to-top characterization parameter

8.3

15.9

°C/W

ψJB

Junction-to-board characterization parameter

46.3

46.9

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Electrical Characteristics

specified at TJ = 25°C, VIN = VOUT(nom) + 1.0 V or VIN = 2.5 V (whichever is greater), IOUT = 1 mA, VON/OFF = 2 V, CIN = 1.0

µF, and COUT = 2.2 µF (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP MAX UNIT

∆VOUT

Output voltage tolerance

IL = 1 mA

Legacy chip

(standard

grade)

-1.5

1.5

%

Legacy chip

(A grade)

-1.0

1.0

%

New chip

-0.5

0.5

%

1 mA ≤ IL ≤ 50 mA

Legacy chip

(standard

grade)

-2.5

2.5

%

Legacy chip

(A grade)

-1.5

1.5

%

New chip

-0.5

0.5

%

1 mA ≤ IL ≤ 150 mA

Legacy chip

(standard

grade)

-3.0

3.0

%

Legacy chip

(A grade)

-2.5

2.5

%

New chip

-0.5

0.5

%

1 mA ≤ IL ≤ 50 mA, –40°C ≤ TJ ≤ 125°C

Legacy chip

(standard

grade)

-3.5

3.5

%

Legacy chip

(A grade)

-2.5

2.5

%

New chip

-1

1

%

1 mA ≤ IL ≤ 150 mA, –40°C ≤ TJ ≤ 125°C

Legacy chip

(standard

grade)

-4.0

4.0

%

Legacy chip

(A grade)

-3.5

3.5

%

New chip

-1

1

%

ΔVOUT(ΔVIN) Line Regulation

VO(NOM) + 1 V ≤ VIN ≤ 16 V

Legacy chip

0.007 0.014

%/V

New chip

0.002 0.014

VO(NOM) + 1 V ≤ VIN ≤ 16 V, –40°C ≤ TJ ≤ 125°C

Legacy chip

0.007 0.032

New chip

0.002 0.032

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LP2985

SLVS522Q – JULY 2004 – REVISED DECEMBER 2022

Copyright © 2022 Texas Instruments Incorporated

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