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DGP20 Datasheet(PDF) 1 Page - Vaishali Semiconductor |
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DGP20 Datasheet(HTML) 1 Page - Vaishali Semiconductor |
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1 / 2 page  ® CGP20 and DGP20 Vishay Semiconductors formerly General Semiconductor Document Number 88568 www.vishay.com 03-Jan-03 1 New Product Miniature Clamper/Damper Glass Passivated Rectifier Reverse Voltage 1400 to 1500V Forward Current 2.0A Patented* 0.034 (0.86) 0.028 (0.71) Dia. 0.140 (3.6) 0.104 (2.6) Dia. 0.230 (5.8) 0.300 (7.6) 1.0 (25.4) min. 1.0 (25.4) min. Maximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol CGP20 DGP20 Unit Maximum repetitive peak reverse voltage VRRM 1400 1500 V Maximum RMS voltage VRMS 980 1050 V Maximum DC blocking voltage VDC 1400 1500 V Maximum average forward rectified current 0.375” (9.5mm) lead length at TA = 50°C IF(AV) 2.0 A Peak forward surge current 8.3ms single half sine wave superimposed on rated load (JEDEC Method) IFSM 40 A Maximum full load reverse current full cycle average 0.375” (9.5mm) lead length at TA = 100°C IR(AV) 200 µA Typical thermal resistance (Note 1) R ΘJA 55 °C/W Operating junction and storage temperature range TJ, TSTG –65 to +175 °C Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol CGP20 DGP20 Unit Maximum instantaneous forward voltage at 2.0A VF 1.1 V Maximum DC reverse current TA = 25°C 5.0 at rated DC blocking voltage TA = 100°C IR 100 µA Maximum reverse recovery time at IF = 0.5A, IR = 50mA trr 15 20 µs Maximum reverse recovery time typical 1.0 at IF=0.5A, IR=1.0A, Irr=0.25A maximum trr 1.5 µs Typical junction capacitance at 4.0V, 1MHz CJ 15 pF Notes: (1) Thermal resistance from junction to ambient at 0.375” (9.5mm) lead length, P.C.B. mounted DO204AC (DO-15) Features • Specially designed for clamping circuits, horizontal deflection systems and damper applications • Plastic package has Underwriters Laboratory Flammability Classification 94V-0. • High temperature metallurgically bonded construction • Cavity-free glass passivated junction • 2.0 ampere operation at TA=50°C with no thermal runaway • Typical IR less than 0.1 µA • Capable of meeting environmental standards of MIL-S-19500 • High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension Mechanical Data Case: JEDEC DO-204AC, molded plastic over glass body Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.015 oz., 0.4 g *Glass-plastic encapsulation technique is covered by Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306. Dimensions in inches and (millimeters) |
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