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BF370 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BF370 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 8 page ![]() 1999 Apr 21 3 Philips Semiconductors Product specification NPN medium frequency transistor BF370 THERMAL CHARACTERISTICS Note 1. Transistor mounted on an FR4 printed-circuit board. CHARACTERISTICS Tj =25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient note 1 250 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT ICBO collector cut-off current IE = 0; VCB =20V −− 400 nA IE = 0; VCB =20V; Tj = 125 °C −− 30 µA IEBO emitter cut-off current IC = 0; VEB =2V −− 100 nA hFE DC current gain IC = 10 mA; VCE =1V 40 −− Cc collector capacitance IE =ie = 0; VCB =10V; f=1MHz − 2.2 − pF Ce emitter capacitance IC =ic = 0; VEB = 1 V; f = 1 MHz −− 4.5 pF Cre feedback capacitance IC = 0; VCB = 10 V; f = 1 MHz − 1.6 − pF fT transition frequency VCE = 10 V; f = 100 MHz IC = 10 mA 500 −− MHz IC = 40 mA 490 −− MHz |
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