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BF419 Datasheet(PDF) 3 Page - NXP Semiconductors

Part # BF419
Description  NPN high-voltage transistor
PDF  8 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BF419 Datasheet(HTML) 3 Page - NXP Semiconductors

  BF419 Datasheet HTML 1Page - NXP Semiconductors BF419 Datasheet HTML 2Page - NXP Semiconductors BF419 Datasheet HTML 3Page - NXP Semiconductors BF419 Datasheet HTML 4Page - NXP Semiconductors BF419 Datasheet HTML 5Page - NXP Semiconductors BF419 Datasheet HTML 6Page - NXP Semiconductors BF419 Datasheet HTML 7Page - NXP Semiconductors BF419 Datasheet HTML 8Page - NXP Semiconductors  
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1997 Apr 09
3
Philips Semiconductors
Product specification
NPN high-voltage transistor
BF419
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Note
1. Precautions should be taken during switch-on of the BF419 where an overshoot of current is likely to occur.
The amplitude of the overshoot depends on the relative magnitude of stray external capacities to the transistor
collector capacity. It is desirable to keep the stray capacities to a minimum by short lead lengths etc. so as to minimize
the area of the switching path.
THERMAL CHARACTERISTICS
CHARACTERISTICS
Tj =25 °C unless otherwise specified.
Note
1. Pulse test: tp ≤ 300 µs; δ≤ 0.02.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCBO
collector-base voltage
open emitter
−
300
V
VCEO
collector-emitter voltage
open base
−
250
V
VEBO
emitter-base voltage
open collector
−
5V
IC
collector current (DC)
−
100
mA
ICM
peak collector current
note 1
−
300
mA
IBM
peak base current
−
100
mA
Ptot
total power dissipation
Tmb ≤ 90 °C
−
6W
Tamb ≤ 70 °C
−
800
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
−
150
°C
Tamb
operating ambient temperature
−65
+150
°C
SYMBOL
PARAMETER
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient
100
K/W
Rth j-mb
thermal resistance from junction to mounting base
10
K/W
SYMBOL
PARAMETER
CONDITIONS
TYP.
MAX.
UNIT
ICBO
collector cut-off current
IE = 0; VCB = 250 V
−
50
nA
IEBO
emitter cut-off current
IC = 0; VEB =3V
−
50
nA
hFE
DC current gain
IC = 20 mA; VCE =10V
45
−
VCEsat
collector-emitter saturation voltage
IC = 200 mA; IB = 20 mA; note 1
−
6V
Cc
collector capacitance
IE =ie = 0; VCB =30V; f=1MHz
−
4.5
pF
Cre
feedback capacitance
IC =ic = 0; VCE =30V; f=1MHz
−
3.5
pF
fT
transition frequency
IC = 15 mA; VCE = 10 V; f = 100 MHz 90
−
MHz



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