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GTL2008 Datasheet(PDF) 2 Page - NXP Semiconductors |
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GTL2008 Datasheet(HTML) 2 Page - NXP Semiconductors |
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2 / 20 page ![]() GTL2008_GTL2107_2 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 02 — 26 September 2006 2 of 20 Philips Semiconductors GTL2008; GTL2107 GTL translator with power good control and high-impedance outputs I Series termination on the LVTTL outputs of 30 Ω I ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115, and 1000 V CDM per JESD22-C101 I Latch-up testing is done to JEDEC Standard JESD78 Class II, Level A which exceeds 500 mA I Package offered: TSSOP28 3. Quick reference data 4. Ordering information The GTL2107 is the Intel designation for the GTL2008 and is identical to the GTL2008 except for the type number and the topside markings. Table 1. Quick reference data Tamb =25 °C Symbol Parameter Conditions Min Typ Max Unit Cio input/output capacitance A port; VO = 3.0 V or 0 V - 2.5 3.5 pF B port; VO =VTT or 0 V - 1.5 2.5 pF Vref = 0.73 V; VTT = 1.1 V tPLH LOW-to-HIGH propagation delay nA to nBI; see Figure 4 14 8 ns nBI to nA or nAO (open-drain outputs); see Figure 14 213 18 ns tPHL HIGH-to-LOW propagation delay nA to nBI; see Figure 4 2 5.5 10 ns nBI to nA or nAO (open-drain outputs); see Figure 14 2 4 10 ns Vref = 0.76 V; VTT = 1.2 V tPLH LOW-to-HIGH propagation delay nA to nBI; see Figure 4 14 8 ns nBI to nA or nAO (open-drain outputs); see Figure 14 213 18 ns tPHL HIGH-to-LOW propagation delay nA to nBI; see Figure 4 2 5.5 10 ns nBI to nA or nAO (open-drain outputs); see Figure 14 2 4 10 ns Table 2. Ordering information Tamb = −40 °C to +85 °C Type number Topside mark Package Name Description Version GTL2008PW GTL2008 TSSOP28 plastic thin shrink small outline package; 28 leads; body width 4.4 mm SOT361-1 GTL2107PW GTL2107 TSSOP28 plastic thin shrink small outline package; 28 leads; body width 4.4 mm SOT361-1 |
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