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BF821 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BF821 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 8 page ![]() 1999 Apr 15 3 Philips Semiconductors Product specification PNP high-voltage transistors BF821; BF823 THERMAL CHARACTERISTICS Note 1. Transistor mounted on an FR4 printed-circuit board. CHARACTERISTICS Tj =25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient note 1 500 K/W SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT ICBO collector cut-off current IE = 0; VCB = −200 V −−10 nA IE = 0; VCB = −200 V; Tj = 150 °C −−10 µA IEBO emitter cut-off current IC = 0; VEB = −5V −−50 nA hFE DC current gain IC = −25 mA; VCE = −20 V 50 − VCEsat collector-emitter saturation voltage IC = −30 mA; IB = −5mA −−800 mV Cre feedback capacitance IC =ic = 0; VCB = −30 V; f = 1 MHz − 1.6 pF fT transition frequency IC = −10 mA; VCE = −10 V; f = 100 MHz 60 − MHz |
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