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HSMS-280F Datasheet(PDF) 5 Page - Agilent(Hewlett-Packard) |
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HSMS-280F Datasheet(HTML) 5 Page - Agilent(Hewlett-Packard) |
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5 / 10 page  5 Table 1. Typical SPICE Parameters. Parameter Units HSMS-280x HSMS-281x HSMS-282x BV V75 25 15 CJ0 pF 1.6 1.1 0.7 EG eV 0.69 0.69 0.69 IBV A 1 E-5 1 E-5 1 E-4 IS A 3 E-8 4.8 E-9 2.2 E-8 N 1.08 1.08 1.08 RS Ω 30 10 6.0 PB (VJ) V 0.65 0.65 0.65 PT (XTI) 2 2 2 M 0.5 0.5 0.5 Applications Information Introduction — Product Selection Agilent’s family of Schottky products provides unique solu- tions to many design problems. The first step in choosing the right product is to select the diode type. All of the products in the HSMS-280x family use the same diode chip, and the same is true of the HSMS-281x and HSMS-282x families. Each family has a different set of characteristics which can be compared most easily by consulting the SPICE parameters in Table 1. A review of these data shows that the HSMS-280x family has the highest breakdown voltage, but at the expense of a high value of series resistance (Rs). In applica- tions which do not require high voltage the HSMS-282x family, with a lower value of series resistance, will offer higher current carrying capacity and better performance. The HSMS- 281x family is a hybrid Schottky (as is the HSMS-280x), offering lower 1/f or flicker noise than the HSMS-282x family. In general, the HSMS-282x family should be the designer’s first choice, with the -280x family reserved for high voltage applica- tions and the HSMS-281x family for low flicker noise applications. Assembly Instructions SOT-323 PCB Footprint A recommended PCB pad layout for the miniature SOT-323 (SC-70) package is shown in Figure 6 (dimensions are in inches). This layout provides ample allowance for package placement by auto- mated assembly equipment without adding parasitics that could impair the performance. 0.026 0.035 0.07 0.016 Figure 6. PCB Pad Layout (dimensions in inches). Assembly Instructions SOT-363 PCB Footprint A recommended PCB pad layout for the miniature SOT-363 (SC-70, 6 lead) package is shown in Figure 7 (dimensions are in inches). This layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the performance. 0.026 0.075 0.016 0.035 Figure 7. PCB Pad Layout (dimensions in inches). |
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