Nexperia

RB751V40

Schottky barrier diode

11. Package outline

03-12-17

Dimensions in mm

0.25

0.10

0.45

0.15

2.7

2.3

1.8

1.6

0.40

0.25

1.1

0.8

1.35

1.15

1

2

Fig. 4. Package outline SOD323

12. Soldering

0.95

1.65

2.2

2.1

3.05

solder lands

solder resist

occupied area

solder paste

0.5

(2×)

0.6

(2×)

0.6 (2×)

0.5 (2×)

sod323_fr

Dimensions in mm

Fig. 5. Reflow soldering footprint for SOD323

1.5 (2×)

2.9

5

1.2

(2×)

2.75

sod323_fw

solder lands

solder resist

occupied area

preferred transport

direction during soldering

Dimensions in mm

Fig. 6. Wave soldering footprint for SOD323

RB751V40

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Product data sheet

1 October 2022

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