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NVT2002GD125 Datasheet(PDF) 22 Page - NXP Semiconductors |
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NVT2002GD125 Datasheet(HTML) 22 Page - NXP Semiconductors |
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22 / 32 page ![]() NXP Semiconductors NVT2001; NVT2002 Bidirectional voltage level translator for open-drain and push-pull applications 15 Soldering: PCB footprints sot886_fr solder resist occupied area solder paste = solderland Dimensions in mm 0.425 (6×) 1.250 0.675 1.700 0.325 (6×) 0.270 (6×) 0.370 (6×) 0.500 0.500 Figure 21. PCB footprint for SOT886 (XSON6); reflow soldering sot505-1_fr occupied area solder lands Dimensions in mm 3.200 3.600 5.750 0.725 0.650 0.125 0.450 0.600 3.600 2.950 0.125 1.150 5.500 Figure 22. PCB footprint for SOT505-1 (TSSOP8); reflow soldering NVT2001_NVT2002 All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved. Product data sheet Rev. 4.4 — 22 May 2023 22 / 32 |
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