Specifications and information are subject to change without notice

WJ Communications, Inc

• Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com

Page 4 of 4 June 2006

ML401

1.7–2.2 GHz High IP3 Mixer with Integrated LO Amp

Product Information

The Communications Edge

TM

ML401-G Mechanical Information

This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free

(maximum 260

°C reflow temperature) and lead (maximum 245 °C reflow temperature) soldering processes.

Outline Drawing

Mounting Configuration / Land Pattern

1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill

and have a final plated thru diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the

heatsink.

4. All dimensions are in millimeters (inches). Angles are in degrees.

5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink.

6. RF trace width depends upon the PC board material and construction.

7. Use 1 oz. Copper minimum.

Thermal Specifications

Parameter

Rating

Operating Case Temperature

-40 to +85

°C

Thermal Resistance, Rth

104

°C / W

Product Marking

The component will be lasermarked with a

“ML401-G”

product

label

with

an

alphanumeric lot code on the top surface of the

package.

Tape and reel specifications for this part will be

located on the website in the “Application

Notes” section.

ESD / MSL Information

ESD Rating: Class 1B

Value:

Passes

500V to <1000V

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

ESD Rating: Class IV

Value:

Passes

1000V

Test:

Charged Device Model (CDM)

Standard:

JEDEC Standard JESD22-C101

MSL Rating: Level 2 at +260

°C convection reflow

Standard:

JEDEC Standard J-STD-020

Functional Pin Layout

Pin

Function

1

LO

2

GND

3

Vcc1

4

Vcc2

5

IF

6

GND

7

GND

8

RF

Backside paddle is RF and DC ground.

1

2

3

4

8

7

6

5

RF

IF

GND

LO

GND

Vcc1

Vcc2

GND

The backside paddle is Ground.