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Product data sheet

Rev. 01 — 25 April 2005

5 of 8

Philips Semiconductors

BAS40H

General-purpose Schottky diode in small SOD123F package

8.

Package outline

9.

Packing information

[1]

For further information and the availability of packing methods, see Section 15.

10. Soldering

Fig 5.

Package outline SOD123F

04-11-29

Dimensions in mm

1.2

1.0

0.25

0.10

3.6

3.4

2.7

2.5

0.55

0.35

0.70

0.55

1.7

1.5

1

2

Table 8:

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code. [1]

Type number

Package

Description

Packing quantity

3000

10000

BAS40H

SOD123F

4 mm pitch, 8 mm tape and reel

-115

-135

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 6.

Reflow soldering footprint SOD123F

1.6

1.6

2.9

4

4.4

1.1 1.2

2.1

1.1

(2

×)

solder lands

solder resist

occupied area

solder paste