1998 May 13

8

Philips Semiconductors

Product specification

HF amplifier modules

BGY148A; BGY148B

SOLDERING

The indicated temperatures are those at the solder

interfaces.

Advised solder types are types with a liquidus less than or

equal to 210

°C.

Solder dots or solder prints must be large enough to wet

the contact areas.

Soldering can be carried out using a conveyor oven, a hot

air oven, an infrared oven or a combination of these ovens.

A double reflow process is permitted.

Hand soldering must be avoided because the soldering

iron tip can exceed the maximum permitted temperature of

250

°C and damage the module.

The maximum allowed temperature is 250

°C for

5 seconds.

The maximum ramp-up is 10

°C per second.

The maximum cool-down is 5

°C per second.

Cleaning

The following fluids may be used for cleaning:

• Alcohol

• Bio-Act (Terpene Hydrocarbon)

• Acetone.

Ultrasonic cleaning should not be used since this can

cause serious damage to the product.

Fig.17 Recommended reflow temperature profile.

handbook, halfpage

0

300

200

100

0

15

23

4

MGM159

t (min)

T

(

°C)