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HMC323 Datasheet(PDF) 5 Page - Hittite Microwave Corporation |
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HMC323 Datasheet(HTML) 5 Page - Hittite Microwave Corporation |
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5 / 6 page ![]() 1 - 154 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com MICROWAVE CORPORATION FEBRUARY 2001 1 Evaluation PCB for HMC323 The circuit board used in the final application should use RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown above. A sufficient number of VIA holes should be used to connect the top and bottom ground planes. The evaluation circuit board as shown is available from Hittite upon request. Evaluation Circuit Board Layout Design Details V 00.1100 HMC323 HBT DRIVER AMPLIFIER DC - 3.0 GHz m e t I n o i t p i r c s e D 2 J - 1 J r o t c e n n o C A M S t n u o M C P 1 U 3 2 3 C M H * B C P " 5 . 1 x " 5 . 1 B C P n o i t a u l a v E 6 9 1 4 0 1 0 5 3 4 s r e g o R : l a i r e t a M d r a o B t i u c r i C * |
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