2000 Feb 02

4

Philips Semiconductors

Preliminary specification

UHF power LDMOS transistor

BLF1047

PACKAGE OUTLINE

Package under

development

Philips Semiconductors reserves the

right to make changes without notice.

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOT541A

99-12-28

00-01-13

0

5

10 mm

scale

Flanged LDMOST ceramic package; 2 mounting holes; 2 leads

SOT541A

p

A

F

b

D

U2

H

Q

c

1

3

2

D1

E

A

w1

AB

M

M

M

C

q

U1

C

B

E1

M

M

w2

UNIT

A

mm

D

b

11.05

10.80

0.18

0.10

15.39

15.09

10.29

10.03

20.83

19.81

9.91

9.65

5.74

4.60

c

U2

0.25

0.51

22.10

qw2

w1

F

1.78

1.52

U1

27.31

27.05

p

3.43

3.18

Q

2.69

2.44

EE1

10.26

10.06

inches

0.435

0.425

0.007

0.004

0.606

0.594

D1

15.39

15.09

0.606

0.594

0.405

0.395

0.820

0.780

0.390

0.380

0.226

0.181

0.01

0.02

0.87

0.070

0.060

1.075

1.065

0.135

0.125

0.106

0.096

0.404

0.396

H

DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)