6 Specifications

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Voltage(2)

IN

–0.3

6.0

V

EN

–0.3

6.0

V

OUT

–0.3

6.0

V

Current (source)

OUT

Internally limited

Output short-circuit duration

Indefinite

Temperature

Operating junction, TJ

–55

150

°C

Storage, Tstg

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.

(2)

All voltages are with respect to network ground pin.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM) QSS 009-105 (JESD22-A114A)(1)

±4000

V

Charged device model (CDM) QSS 009-147 (JESD22-C101B.01)(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage

2.0

5.5

V

IOUT

Output current

0

200

mA

TJ

Operating junction temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

TLV707, TLV707P

UNIT

DQN (X2SON)

4 PINS

RθJA

Junction-to-ambient thermal resistance

208.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

108.8

°C/W

RθJB

Junction-to-board thermal resistance

159.4

°C/W

ψJT

Junction-to-top characterization parameter

3.8

°C/W

ψJB

Junction-to-board characterization parameter

159.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

110.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

TLV707, TLV707P

SBVS153G – FEBRUARY 2011 – REVISED JUNE 2023

www.ti.com

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