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S29GL-M Datasheet(PDF) 18 Page - SPANSION

Part # S29GL-M
Description  256,128,64,32,Megabit 3.0 Volt-only Page Mode Flash Memory featuring 0.23 關m MirrorBit Process Technology
PDF  116 Pages
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Manufacturer  SPANSION [SPANSION]
Direct Link  http://www.spansion.com
Logo SPANSION - SPANSION

S29GL-M Datasheet(HTML) 18 Page - SPANSION

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S29GL-M MirrorBitTM Flash Family
S29GL-M_00_B6 October 10, 2006
Data
Sheet
Ordering Information: S29GL032M
S29GL032M Standard Products
Standard products are available in several packages and operating ranges. The order number (Valid Combination)
is formed by a combination of the following:
This product has been retired and is not recommended for designs. For new and current designs, S29GL032A supersedes S29GL032M, and is the
factory-recommended migration path. Please refer to the S29GL-A Datasheet for specifications and ordering information.
S29GL032M
10
T
A
I
R1
0
PACKING TYPE
0= Tray
2
= 7” Tape and Reel
3
= 13” Tape and Reel
MODEL NUMBER
R0
= x8, VCC=3.0-3.6V, Uniform sector device
R1
= x8/x16, VCC=3.0-3.6V, Uniform sector device, highest address sector
protected when WP#/ACC=VIL
R2
= x8/x16, VCC=3.0-3.6V, Uniform sector device, lowest address sector
protected when WP#/ACC=VIL
R3
= x8/x16, VCC=3.0-3.6V, Top boot sector device, top two address sectors
protected when WP#/ACC=VIL
R4
= x8/x16, VCC=3.0-3.6V, Bottom boot sector device, bottom two
address sectors protected when WP#/ACC=VIL
TEMPERATURE RANGE
I
= Industrial (–40
°C to +85°C)
C
= Commercial (0
°C to +70°C)
PACKAGE MATERIAL SET
A= Standard
F
= Pb-Free
B= Standard
C
= Pb-Free
PACKAGE TYPE
T
= Thin Small Outline Package (TSOP) Standard Pinout
B
= Fine-pitch Ball-Grid Array Package
F
= Fortified Ball-Grid Array Package
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER/DESCRIPTION
S29GL032M
32 Megabit Page-Mode Flash Memory Manufactured using 0.23 µm MirrorBit™
Process Technology, 3.0 Volt-only Read, Program, and Erase



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