DG3000

Vishay Siliconix

Document Number: 71742

S-21483—Rev. C, 26-Aug-02

www.vishay.com

9

PACKAGE OUTLINE

MICRO FOOT: 6−BUMP (2 X 3, 0.5−mm PITCH)

NOTES (Unless Otherwise Specified):

1.

Bump is Eutectic 63/57 Sn/Pb.

2.

Non-solder mask defined copper landing pad.

3.

Laser Mark on silicon die back; no coating. Shown is not actual marking; sample only.

Index-Bump A1

Note 3

Top Side (Die Back)

XXX

3000

Recommended Land Pattern

0.5

0.5

6

O 0.150 X 0.180

Note 2

Solder Mask

O X 0.280

Silicon

Bump

Note 1

b Diameter

32

1

A

B

e

D

e

A

S

S

E

MILLIMETERS*

INCHES

Dim

Min

Max

Min

Max

A

0.615

0.715

0.0242

0.0281

0.140

0.190

0.0055

0.0075

0.475

0.525

0.0187

0.0207

b

0.180

0.250

0.0071

0.0098

D

1.555

1.585

0.0612

0.0624

E

1.055

1.085

0.0415

0.0427

e

0.5 BASIC

0.0197 BASIC

S

0.278

0.293

0.0109

0.0115

* Use millimeters as the primary measurement.