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EPA2013D Datasheet(PDF) 1 Page - PCA ELECTRONICS INC. |
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EPA2013D Datasheet(HTML) 1 Page - PCA ELECTRONICS INC. |
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1 / 1 page ![]() E L E C T R O N I C S I N C . 10Base-T Interface Module TEL: (818) 892-0761 FAX: (818) 894-5791 http://www.pca.com PCA ELECTRONICS, INC. 16799 SCHOENBORN ST. NORTH HILLS, CA 91343 • General Purpose 10Base-T Filter Module • Complies with or exceeds IEEE 802.3, 10Base-T Standards • Add “-RC” after part number for RoHS Compliant • Available in SMD and DIP Packages EPA2013D & EPA2013D-RC Product performance is limited to specified parameters. Data is subject to change without prior notice. Electrical Parameters @ 25° C Unless Otherwise Specified Dimensions are in Inches /mm ± .010 /.25 CSA2013D & --RC Rev. G2 9/20/06 JDG • Isolation : meets or exceeds 802.3 IEEE Requirements • Characteristic Filter Impedance : 100 Ω • • Referenced to the Output Level Fundamental Frequency @ 5 MHz • CMC is common to both channels • Common Mode Rejection (dB Min.) Insertion Loss (dB Max.) 1-10 MHz -1/-1 Xmit/Rcv Return Loss (dB Min.) 5-10 MHz -15/-15 Xmit/Rcv @ 25 MHz -19/-14 Xmit/Rcv @ 100 MHz Xmit -25 @ 30 MHz -30/-20 Xmit/Rcv Cut-Off Frequency (MHz) ± 1.0 MHz 17/17 Xmit/Rcv @ 50 MHz Xmit -30 Crosstalk (dB Min.) -30/-30 1-10 MHz Xmit/Rcv Attenuation (dB Min.) @ 20 MHz -7/-6 Xmit/Rcv @ 40 MHz -35/-31 Xmit/Rcv Schematic Transmit Channel 14 15 16 3 1 LPF 2 1:1 Receive Channel 9 10 11 8 6 LPF 7 1:1 Notes : 1. Lead Finish 2. Peak Temperature Rating (Wave Solder Process Only) (per IPC/JEDEC-J-STD-020C) 3. Weight 4. Packaging Information (Tube) EPA2013D-RC 260°C 10 (+2/-0) seconds 2.8 grams 19 pieces/tube EPA2013D 225°C 2.8 grams 19 pieces/tube SnPb Hot Tin Dip (Sn) † † Lead Material : Matte Tin with Ni Barrier Package .310/.375 (7.87/9.53) Pin 1 I.D. .125/.150 (3.18/3.81) .100 (2.54) .008/.012 (.203/.305) PCA EPA2013D(-RC) Date Code .145 (3.68) .300 (7.62) .990 (25.15) .020/.030 (.508/.762) .300 (7.62) .018/.022 (.457/.599) .700 (17.78) .270 (6.86) .325 (8.26) .700 (17.78) Component Outline .390 x .990 (10.13 x 25.15) Suggested PCB Layout .300 (7.62) .034 Ø (.864) Drill .060 Ø (1.52) Solder Pad |
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