March 1993

13

Philips Semiconductors

Product specification

UHF power transistor

BLV193

PACKAGE OUTLINE

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOT171A

97-06-28

0

5

10 mm

scale

Flanged ceramic package; 2 mounting holes; 6 leads

SOT171A

1

2

3

4

5

6

U2

E

E1

H

Q

D

D1

A

F

c

A

b

M

w3

H1

M

b1

C

w2

e

U1

q

p

C

w1

AB

M

B

UNIT

A

mm

D

b

2.15

1.85

b1

3.20

2.89

0.16

0.07

9.25

9.04

D1

9.30

8.99

E

5.95

5.74

3.58

11.31

10.54

6.00

5.70

6.81

6.07

c

E1

U2

0.26

0.51

1.02

w3

18.42

qw2

w1

F

3.05

2.54

U1

24.90

24.63

H1

9.27

9.01

p

3.43

3.17

Q

4.32

4.11

e

6.00

5.70

inches

0.085

0.073

0.126

0.114

0.006

0.003

0.364

0.356

0.366

0.354

0.234

0.226

0.140

0.445

0.415

0.236

0.224

0.268

0.239

0.01

0.02

0.04

0.725

0.120

0.100

0.980

0.970

0.365

0.355

0.135

0.125

0.170

0.162

0.236

0.224

H

DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)