CD54HC4051F3A datasheet(7/49 Pages) TI

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CD54HC4051, CD74HC4051

CD54HCT4051, CD74HCT4051, CD54HC4052, CD74HC4052, CD54HCT4052

CD74HCT4052, CD54HC4053, CD74HC4053, CD54HCT4053, CD74HCT4053

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SCHS122M – NOVEMBER 1997 – REVISED MAY 2019

Product Folder Links: CD54HC4051 CD74HC4051 CD54HCT4051 CD74HCT4051 CD54HC4052 CD74HC4052

CD54HCT4052 CD74HCT4052 CD54HC4053 CD74HC4053 CD54HCT4053 CD74HCT4053

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

CD74HC4051

UNIT

N (PDIP)

NS (SO)

PW (TSSOP)

16 PINS

RθJA

Junction-to-ambient thermal resistance

49.0

83.0

107.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

36.3

41.2

42.4

°C/W

RθJB

Junction-to-board thermal resistance

29.0

43.3

52.8

°C/W

ψJT

Junction-to-top characterization parameter

21.2

9.2

4.2

°C/W

ψJB

Junction-to-board characterization parameter

28.9

43.0

52.2

°C/W

6.5 Electrical Characteristics: HC Devices

PARAMETERS

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VIS

(V)

VEE

(V)

VCC

(V)

VIH

High-level input voltage

25°C

1.5

–40°C to

+85°C

1.5

–55°C to

+125°C

1.5

4.5

25°C

3.15

–40°C to

+85°C

3.15

–55°C to

+125°C

3.15

25°C

4.2

–40°C to

+85°C

4.2

–55°C to

+125°C

4.2

VIL

Low-level input voltage

25°C

0.5

–40°C to

+85°C

0.5

–55°C to

+125°C

0.5

4.5

25°C

1.35

–40°C to

+85°C

1.35

–55°C to

+125°C

1.35

25°C

1.8

–40°C to

+85°C

1.8

–55°C to

+125°C

1.8

CD54HC4051F3A Datasheet(PDF) 7 Page - Texas Instruments

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