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CS5302 Datasheet(PDF) 14 Page - ON Semiconductor

Part # CS5302
Description  Two?뭁hase Buck Controller with Integrated Gate Drivers and 4?묪it DAC
PDF  17 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

CS5302 Datasheet(HTML) 14 Page - ON Semiconductor

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CS5302
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14
drive traces should be kept as short and wide as practical and
should have a return path directly below the gate trace.
Output filter components should be placed on wide planes
connected directly to the load to minimize resistive drops
during heavy loads and inductive drops and ringing during
transients. If required, the planes for the output voltage and
return can be interleaved to minimize inductance between
the filter and load.
Voltage feedback should be taken from a point of the
output or the output filter that doesn’t favor any one phase.
If the feedback connection is closer to one inductor than the
others the ripple associated with that phase may appear
larger than the ripple associated with the other phases and
poor current sharing can result.
The current sense signal is typically tens of milli−volts.
Noise pick−up should be avoided wherever possible.
Current feedback traces should be routed away from noisy
areas such as switch nodes and gate drive signals. The paths
should be matched as well as possible. It is especially
important that all current sense signals be picked off at
similar points for accurate current sharing. If the current
signal is taken from a place other than directly at the inductor
any additional resistance between the pick−off point and the
inductor appears as part of the inherent inductor resistance
and should be considered in design calculations. Capacitors
for the current feedback networks should be placed as close
to the current sense pins as practical.
DESIGN PROCEDURE
Current Sensing, Power Stage and
Output Filter Components
1. Choose the output filter components to meet peak
transient requirements. The formula below can be
used to provide an approximate starting point for
capacitor choice, but will be inadequate to calculate
actual values.
DVPEAK + (DI DT)
ESL ) DI
ESR
Ideally the output filter should be simulated with
models including ESR, ESL, circuit board parasitics
and delays due to switching frequency and converter
response.
Typically
both
bulk
capacitance
(electrolytic, Oscon, etc.,) and low impedance
capacitance (ceramic chip) will be required. The bulk
capacitance provides “hold up” during the converter
response. The low impedance capacitance reduces
steady state ripple and bypasses the bulk capacitance
during slewing of output current.
2. For inductive current sensing (only) choose the
current sense network RC to provide a 25 mV
minimum ramp during steady state operation.
R + (VIN * VOUT)
VOUT VIN
F
C
25 mV
Then choose the inductor value and inherent
resistance to satisfy L/RL = R × C.
For ideal current sense compensation the ratio of L and
RL is fixed, so the values of L and RL will be a
compromise typically with the maximum value RL
limited by conduction losses or inductor temperature
rise and the minimum value of L limited by ripple
current.
3. For resistive current sensing choose L and RS to
provide a steady state ramp greater than 25 mV.
L RS + (VIN * VOUT)
TON 25 mV
Again the ratio of L and RL is fixed and the values of
L and RS will be a compromise.
4. Calculate the high frequency output impedance
(ConverterZ) of the converter during transients. This
is the impedance of the Output filter ESR in parallel
with the power stage output impedance (PwrstgZ)
and will indicate how far from the original level
(ΔVR) the output voltage will typically recover to
within one switching cycle. For a good transient
response ΔVR should be less than the peak output
voltage overshoot or undershoot.
DVR + ConverterZ
ESR
ConverterZ +
PwrstgZ
ESR
PwrstgZ ) ESR
where:
PwrstgZ + RS
CSA Gain 3.0
Multiply the converterZ by the output current step
size to calculate where the output voltage should
recover to within the first switching cycle after a
transient. If the ConverterZ is higher than the value
required to recover to where the adaptive positioning
is set the remainder of the recovery will be controlled
by the error amp compensation and will typically
recover in 10−20 μs.
DVR + DIOUT
ConverterZ
Make sure that ΔVR is less than the expected peak
transient for a good transient response.
5. Adjust L and RL or RS as required to meet the best
combination of transient response, steady state output
voltage ripple and pulse width jitter.
Current Limit
When the sum of the Current Sense amplifiers (VITOTAL)
exceeds the voltage on the ILIM pin the part will enter hiccup
mode. For inductive sensing the ILIM pin voltage should be
set based on the inductor resistance (or current sense
resistor) at max temperature and max current. To set the level
of the ILIM pin:
6. VI(LIM) + R IOUT(LIM) CS to ILIM Gain
where:
R is RL or RS;
IOUT(LIM) is the current limit threshold.



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