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CS5302 Datasheet(PDF) 14 Page - ON Semiconductor |
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CS5302 Datasheet(HTML) 14 Page - ON Semiconductor |
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14 / 17 page ![]() CS5302 http://onsemi.com 14 drive traces should be kept as short and wide as practical and should have a return path directly below the gate trace. Output filter components should be placed on wide planes connected directly to the load to minimize resistive drops during heavy loads and inductive drops and ringing during transients. If required, the planes for the output voltage and return can be interleaved to minimize inductance between the filter and load. Voltage feedback should be taken from a point of the output or the output filter that doesn’t favor any one phase. If the feedback connection is closer to one inductor than the others the ripple associated with that phase may appear larger than the ripple associated with the other phases and poor current sharing can result. The current sense signal is typically tens of milli−volts. Noise pick−up should be avoided wherever possible. Current feedback traces should be routed away from noisy areas such as switch nodes and gate drive signals. The paths should be matched as well as possible. It is especially important that all current sense signals be picked off at similar points for accurate current sharing. If the current signal is taken from a place other than directly at the inductor any additional resistance between the pick−off point and the inductor appears as part of the inherent inductor resistance and should be considered in design calculations. Capacitors for the current feedback networks should be placed as close to the current sense pins as practical. DESIGN PROCEDURE Current Sensing, Power Stage and Output Filter Components 1. Choose the output filter components to meet peak transient requirements. The formula below can be used to provide an approximate starting point for capacitor choice, but will be inadequate to calculate actual values. DVPEAK + (DI DT) ESL ) DI ESR Ideally the output filter should be simulated with models including ESR, ESL, circuit board parasitics and delays due to switching frequency and converter response. Typically both bulk capacitance (electrolytic, Oscon, etc.,) and low impedance capacitance (ceramic chip) will be required. The bulk capacitance provides “hold up” during the converter response. The low impedance capacitance reduces steady state ripple and bypasses the bulk capacitance during slewing of output current. 2. For inductive current sensing (only) choose the current sense network RC to provide a 25 mV minimum ramp during steady state operation. R + (VIN * VOUT) VOUT VIN F C 25 mV Then choose the inductor value and inherent resistance to satisfy L/RL = R × C. For ideal current sense compensation the ratio of L and RL is fixed, so the values of L and RL will be a compromise typically with the maximum value RL limited by conduction losses or inductor temperature rise and the minimum value of L limited by ripple current. 3. For resistive current sensing choose L and RS to provide a steady state ramp greater than 25 mV. L RS + (VIN * VOUT) TON 25 mV Again the ratio of L and RL is fixed and the values of L and RS will be a compromise. 4. Calculate the high frequency output impedance (ConverterZ) of the converter during transients. This is the impedance of the Output filter ESR in parallel with the power stage output impedance (PwrstgZ) and will indicate how far from the original level (ΔVR) the output voltage will typically recover to within one switching cycle. For a good transient response ΔVR should be less than the peak output voltage overshoot or undershoot. DVR + ConverterZ ESR ConverterZ + PwrstgZ ESR PwrstgZ ) ESR where: PwrstgZ + RS CSA Gain 3.0 Multiply the converterZ by the output current step size to calculate where the output voltage should recover to within the first switching cycle after a transient. If the ConverterZ is higher than the value required to recover to where the adaptive positioning is set the remainder of the recovery will be controlled by the error amp compensation and will typically recover in 10−20 μs. DVR + DIOUT ConverterZ Make sure that ΔVR is less than the expected peak transient for a good transient response. 5. Adjust L and RL or RS as required to meet the best combination of transient response, steady state output voltage ripple and pulse width jitter. Current Limit When the sum of the Current Sense amplifiers (VITOTAL) exceeds the voltage on the ILIM pin the part will enter hiccup mode. For inductive sensing the ILIM pin voltage should be set based on the inductor resistance (or current sense resistor) at max temperature and max current. To set the level of the ILIM pin: 6. VI(LIM) + R IOUT(LIM) CS to ILIM Gain where: R is RL or RS; IOUT(LIM) is the current limit threshold. |
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