MC68340 datasheet(431/441 Pages) FREESCALE

431 / 441 page

12-6

MC68340 USER’S MANUAL

MOTOROLA

12.3 PACKAGE DIMENSIONS

12.3.1 FE Suffix

PIN ONE INDEN

TRIMMED, FORMED DISCRET

SHOWING DATUM FEATUR

0.50

TX Y

0.10

∩

SEATING PLANE

144X

0.20

X-Y

144X

S/V

0.20

X-Y

SIDE VIEW

GULL WING LEAD CONFIGURA

TOP VIEW

DIM

MILLIMETE

INCHE

MIN

MAX

MIN

MAX

25.84

27.70

1.017

1.09

25.84

27.70

1.017

1.09

3.55

4.31

0.140

0.170

0.22

0.41

0.009

0.016

0.65 BS

0.0256 BS

0.25

0.88

0.010

0.035

0.13

0.25

0.005

0.010

0.65

0.95

0.026

0.037

0°

0.325 BS

0.0128 BS

°°

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M

2. CONTROLLING DIMENSION: MILLIMETERS

3. DIM A AND B DEFINE MAXIMUM CERAMIC BODY DIMEN

INCLUDING GLASS PROTRUSION AND MISMATCH OF CE

BODY TOP AND BOTTOM.

4. DATUM PLANE -W- IS LOCATED AT THE UNDERSIDE O

WHERE LEADS EXIT PACKAGE BODY.

5. DATUMS X-Y AND Z TO BE DETERMINED WHERE CENT

EXIT PACKAGE BODY AT DATUM -W-.

6. DIM S AND V TO BE DETERMINED AT SEATING PLANE

7. DIM A AND B TO BE DETERMINED AT DATUM PLANE -

FE SUFFIX PACKAG

CERAMIC QFP

CASE 863A-01

Freescale Semiconductor, Inc.

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