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IXFR34N80 Datasheet(PDF) 1 Page - IXYS Corporation |
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IXFR34N80 Datasheet(HTML) 1 Page - IXYS Corporation |
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1 / 2 page ![]() © 2000 IXYS All rights reserved Symbol Test Conditions Maximum Ratings V DSS T J = 25 °C to 150°C 800 V V DGR T J = 25 °C to 150°C; R GS = 1 MΩ 800 V V GS Continuous ±20 V V GSM Transient ±30 V I D25 T C = 25 °C (MOSFET chip capability) 28 A I DM T C = 25 °C, Note 1 600 A I AR T C = 25 °C 150 A E AR T C = 25 °C60 mJ E AS T C = 25 °C3 J dv/dt I S ≤ I DM, di/dt ≤ 100 A/µs, VDD ≤ VDSS 5 V/ns T J ≤ 150°C, R G = 2 Ω P D T C = 25 °C 400 W T J -55 ... +150 °C T JM 150 °C T stg -55 ... +150 °C T L 1.6 mm (0.063 in.) from case for 10 s 300 °C V ISOL 50/60 Hz, RMS t = 1 min 2500 V~ Weight 5 g Symbol Test Conditions Characteristic Values (T J = 25°C, unless otherwise specified) min. typ. max. V DSS V GS = 0 V, ID = 3mA 150 V V GS(th) V DS = VGS, ID = 8mA 2.0 4.0 V I GSS V GS = ±20 V, VDS = 0 ±100 nA I DSS V DS = VDSS T J = 25 °C 100 µA V GS = 0 V T J = 125 °C 2 mA R DS(on) V GS = 10 V, ID = IT 0.24 Ω Notes 2, 3 Single MOSFET Die Avalanche Rated 98674A (02/00) ISOPLUS 247TM HiPerFETTM Power MOSFETs ISOPLUS247TM (Electrically Isolated Backside) Features l Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation l Low drain to tab capacitance(<25pF) l Low R DS (on) HDMOS TM process l Rugged polysilicon gate cell structure l Unclamped Inductive Switching (UIS) rated l Fast intrinsic Rectifier Applications l DC-DC converters l Battery chargers l Switched-mode and resonant-mode power supplies l DC choppers l AC motor control Advantages l Easy assembly l Space savings l High power density G = Gate D = Drain S = Source * Patent pending IXFR 34N80 V DSS = 800 V I D25 = 28 A R DS(on) = 0.24 Ω Ω Ω Ω Ω t rr ≤ ≤≤≤≤ 250 ns E153432 Isolated backside* G D S Preliminary Data Sheet |
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