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LM3208 Datasheet(PDF) 12 Page - National Semiconductor (TI) |
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LM3208 Datasheet(HTML) 12 Page - National Semiconductor (TI) |
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12 / 17 page ![]() Block Diagram Operation Description The LM3208 is a simple, step-down DC-DC converter opti- mized for powering RF power amplifiers (PAs) in mobile phones, portable communicators, and similar battery pow- ered RF devices. It is designed to allow the RF PA to operate at maximum efficiency over a wide range of power levels from a single Li-Ion battery cell. It is based on a current- mode buck architecture, with synchronous rectification for high efficiency. It is designed for a maximum load capability of 650mA when V OUT > 1.05V (typ.) and 400mA when VOUT < 1.00V (typ.) in PWM mode. Maximum load range may vary from this depending on input voltage, output voltage and the inductor chosen. Efficiency is typically around 95% for a 400mA load with 3.4V output, 3.9V input. The LM3208 has an R DSON management scheme to increase efficiency when V OUT ≤ 1V. The output voltage is dynamically programmable from 0.8V to 3.6V by adjusting the voltage on the control pin without the need for external feedback resistors. This prolongs battery life by changing the PA supply voltage dynamically depending on its transmitting power. Additional features include current overload protection and thermal overload shutdown. The LM3208 is constructed using a chip-scale 8-pin micro SMD package. This package offers the smallest possible size, for space-critical applications such as cell phones, where board area is an important design consideration. Use of a high switching frequency (2MHz, typ.) reduces the size of external components. As shown in Figure 1, only three external power components are required for implementation. Use of a micro SMD package requires special design con- siderations for implementation. (See Micro SMD Package Assembly and use in the Applications Information section.) Its fine bump-pitch requires careful board design and preci- sion assembly equipment. Use of this package is best suited for opaque-case applications, where its edges are not sub- ject to high-intensity ambient red or infrared light. In addition, the system controller should set EN low during power-up and other low supply voltage conditions. (See Shutdown Mode in the Device Information section.) 20166304 FIGURE 2. Functional Block Diagram www.national.com 12 |
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