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LP2985 Datasheet(PDF) 22 Page - Texas Instruments |
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LP2985 Datasheet(HTML) 22 Page - Texas Instruments |
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22 / 41 page  the junction temperature. Use the junction-to-board characterization parameter (ψJB) with the PCB surface temperature 1 mm from the device package (TB) to calculate the junction temperature. TJ = TT + ψJT × PD (4) where: • PD is the dissipated power • TT is the temperature at the center-top of the device package TJ = TB + ψJB × PD (5) where: • TB is the PCB surface temperature measured 1 mm from the device package and centered on the package edge For detailed information on the thermal metrics and how to use them, see the Semiconductor and IC Package Thermal Metrics application note. LP2985, LP2985A SLVS522R – JULY 2004 – REVISED JULY 2023 www.ti.com 22 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: LP2985 LP2985A |
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