Data Sheet S14000EJ2V0DS

11

µµµµ PD16364

6. RECOMMENDED SOLDERING CONDITIONS

The following conditions must be met for soldering conditions of the

µ PD16364.

For more details, refer to the Semiconductor Device Mounting Technology Manual (C10535E).

Please consult with our sales offices in case other soldering process is used, or in case the soldering is done

under different conditions.

µPD16364N-×××: TCP (TAB package)

Mounting Condition

Mounting Method

Condition

Soldering

Heating tool 300 to 350°C: heating for 2 to 3 seconds: pressure 100g (per

solder)

Thermocompression

ACF

(Adhesive

Conductive Film)

Temporary bonding 70 to 100°C: pressure 3 to 8 kg/cm

2: time 3 to 5

seconds.

Real bonding 165 to 180°C: pressure 25 to 45 kg/cm

2: time 30 to 40

seconds. (When using the anisotropy conductive film SUMIZAC1003 of

Sumitomo Bakelite, Ltd.)

Caution To find out the detailed conditions for packaging the ACF part, please contact the ACF

manufacturing company. Be sure to avoid using two or more packaging methods at a time.