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BU506DF Datasheet(PDF) 3 Page - NXP Semiconductors |
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BU506DF Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 12 page ![]() 1997 Aug 14 2 Philips Semiconductors Product specification Silicon diffused power transistors BU506F; BU506DF LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCESM collector-emitter peak voltage VBE =0 − 1500 V VCEO collector-emitter voltage open base − 700 V ICsat collector saturation current VCE =5V − 3A IC collector current (DC) see Figs 2 and 3 − 5A ICM collector current (peak value) see Figs 2 and 3 − 8A IB base current (DC) − 3A IBM base current (peak value) − 5A Ptot total power dissipation Th ≤ 25 °C; see Fig.4 − 20 W Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C ISOLATION CHARACTERISTICS CHARACTERISTICS Tj =25 °C unless otherwise specified. SYMBOL PARAMETER TYP. MAX. UNIT VisolM isolation voltage from all terminals to external heatsink (peak value) − 1500 V Cisol isolation capacitance from collector to external heatsink 12 − pF SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VCEOsust collector-emitter sustaining voltage IC = 100 mA; IB = 0; L = 25 mH; see Figs 5 and 6 700 −− V VCEsat collector-emitter saturation voltage IC = 3 A; IB = 1.33 A; see Figs 7 and 8 −− 1V VBEsat base-emitter saturation voltage IC = 3 A; IB = 1.33 A; see Fig.9 −− 1.3 V VF diode forward voltage (BU506DF) IF =3A − 1.5 2.2 V ICES collector-emitter cut-off current VCE =VCESmax; VBE =0 −− 0.5 mA VCE =VCESmax; VBE =0; Tj = 125 °C −− 1mA IEBO emitter-base cut-off current VEB =6V; IC =0 −− 10 mA hFE DC current gain VCE =5V; IC = 3 A; see Fig.10 2.25 −− VCE =5V; IC = 100 mA; see Fig.10 613 30 Switching times in horizontal deflection circuit (see Fig.11) ts storage time ICsat =3A;LB =12 µH; IB(end) = 1 A; dIB/dt = −0.33 A/µs − 6.5 −µs tf fall time ICsat =3A;LB =12 µH; IB(end) = 1 A; dIB/dt = −0.33 A/µs − 0.7 −µs |
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