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BUJ103 Datasheet(PDF) 2 Page - NXP Semiconductors

Part # BUJ103
Description  Silicon Diffused Power Transistor
PDF  12 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BUJ103 Datasheet(HTML) 2 Page - NXP Semiconductors

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August 1998
1
Rev 1.000
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BUJ103A
GENERAL DESCRIPTION
High-voltage, high-speed planar-passivated npn power switching transistor in TO220AB envelope intended for use
in high frequency electronic lighting ballast applications, converters, inverters, switching regulators, motor control
systems, etc.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
TYP.
MAX.
UNIT
V
CESM
Collector-emitter voltage peak value
V
BE = 0 V
-
700
V
V
CBO
Collector-Base voltage (open emitter)
-
700
V
V
CEO
Collector-emitter voltage (open base)
-
400
V
I
C
Collector current (DC)
2
-
4
A
I
CM
Collector current peak value
-
8
A
P
tot
Total power dissipation
T
mb ≤ 25 ˚C
-
80
W
V
CEsat
Collector-emitter saturation voltage
I
C = 3.0 A;IB = 0.6 A
0.25
1.0
V
h
FEsat
I
C = 3.0 A; VCE = 5 V
12.5
-
t
f
Fall time
Ic=2A,I
B1=0.4A
33
80
ns
PINNING - TO220AB
PIN CONFIGURATION
SYMBOL
PIN
DESCRIPTION
1
base
2
collector
3
emitter
tab
collector
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CESM
Collector to emitter voltage
V
BE = 0 V
-
700
V
V
CEO
Collector to emitter voltage (open base)
-
400
V
V
CBO
Collector to base voltage (open emitter)
-
700
V
I
C
Collector current (DC)
-
4
A
I
CM
Collector current peak value
-
8
A
I
B
Base current (DC)
-
2
A
I
BM
Base current peak value
-
4
A
P
tot
Total power dissipation
T
mb ≤ 25 ˚C
-
80
W
T
stg
Storage temperature
-65
150
˚C
T
j
Junction temperature
-
150
˚C
THERMAL RESISTANCES
SYMBOL
PARAMETER
CONDITIONS
TYP.
MAX.
UNIT
R
th j-mb
Junction to mounting base
-
1.56
K/W
R
th j-a
Junction to ambient
in free air
60
-
K/W
12 3
tab
b
c
e



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