5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage range

−0.5

7

V

VI

2

Input voltage range

−0.5

VCC + 0.5

V

VO

2

Output voltage range

−0.5

VCC + 0.5

V

IIK

Input clamp current

(VI < 0 or VI > VCC)

±20

mA

IOK

Output clamp current

(VO < 0 or VO > VCC)

±20

mA

IO

Continuous output current

(VO = 0 to VCC)

±50

mA

Continuous current through VCC or GND

±200

mA

Tstg

Storage temperature range

−65

150

°C

(1)

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

5.2 ESD Ratings

VALUE

UNIT

V (ESD)

Electrostatic discharge

Human body model (HBM), per AEC Q100-002(1)

±2000

V

Charged device model (CDM), per AEC Q100-011

±1000

(1)

AEC Q100-002 indicates that HBM stressing must be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage

4.5

5.5

V

VIH

High-level input voltage

2

V

VIL

Low-level input voltage

0.8

V

VI

Input voltage

0

VCC

V

VO

Output voltage

0

VCC

V

IOH

High-level output current

−24

mA

IOL

Low-level output current

24

mA

∆t/∆v

Input transition rise or fall rate

8

ns/V

TA

Operating free-air temperature

SN74ACT244I

−40

85

°C

SN74ACT244Q

−40

125

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

5.4 Thermal Information

THERMAL METRIC(1)

SN74ACT244-Q1

UNIT

PW

RKS

20 PINS

20 PINS

RθJA

Junction-to-ambient thermal resistance

83

67.7

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

SN74ACT244-Q1

SCAS766C – APRIL 2004 – REVISED JULY 2023

www.ti.com

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